PACKAGE SCIENCE SERVICES
IC PACKAGING EXPERTS SiP DESIGN SPECIALISTS
Some people dream of success. We make it happen.
SERVICES
Thermal Modeling: Heat Flux Result FEM
BULLETIN!
PSS now has 3D printing capability! Click here for more information.
DESIGN
You need a package for your chip and want a turnkey solution from concept to production? We can package any type of semiconductor device with the right performance and cost, from two-lead devices to complex microprocessors and ASIC's...
THERMAL
MECHANICAL
Thermal management is one of the primary solutions needed for most semiconductor devices. PSS provides a comprehensive set of skills to solve your thermal problems as well as mechanical analysis needs...
ELECTRICAL
Complete signal and power integrity solutions. We use state-of the-art instruments, software and techniques to insure the speed and performance your chip requires. Measurements, models and simulation...
SUPPORT
PSS provides support services for all package related processes. Mechanical design, simulation and analysis, fixtures and assembly toolng. We also provide reliability and test support...
CORE EXPERTISE
IC PACKAGING - SiP, IoT PACKAGING EXPERTS
PSS Mission
Provide best-in-class engineering services from concept through mass production using state-of-the-art tools and techniques in modeling, simulation, measurement and analysis for the design, development and manufacturing of integrated circuit packaging and related technologies
BULLETIN!
PSS now has 3D printing capability! Click here for more information.
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IC PACKAGE DESIGN
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THERMAL MODELING FEM/CFD
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THERMAL ANALYSIS / DESIGN
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THERMAL MEASUREMENTS
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ELECTROMAGNETIC MODELING / ANALYSIS
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MECHANICAL DESIGN
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MECHANICAL MODELING / FEM
- 3D PRINT AND CNC SUPPORT / DESIGN
- PROCESS / MATERIALS SUPPORT